Spreadtrum wins new members of GlobalPlatform

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On January 20, 2016, GlobalPlatform (hereinafter referred to as "GP Organization", an international standard organization for application management standardization based on security chip technology) announced that its membership has continued to grow. Spreadtrum Communications Co., Ltd. joined The latest participating members of its organization. Spreadtrum Communications (Shanghai) Co., Ltd. (hereinafter referred to as "Exhibition") is a chip design company headquartered in Shanghai with products and services covering the whole world. It is dedicated to the development of mobile phone chip platforms for smart phones, functional mobile phones and other consumer electronic products. The product supports 2G, 3G and 4G wireless communication standards. As a participating member of the GP organization, Spreadtrum was selected to join its terminal technical committee to assist in its management, research and development, sustainability and evolution of the Trusted Execution Environment (TEE) technical specification standards. In addition, Spreadtrum will also join the GP's Mobile Task Force (MTF), whose mission is to assess the business and market needs of the secure mobile service ecosystem and to ensure a consistent set of operability and operability. Chip technology standard application management infrastructure. Dr. Li Liyou, Chairman and CEO of Spreadtrum, said, "With the rapid growth of the influence of the GP organization in China, we believe that it is necessary for the company's products to meet the latest safety chip industry standards. By joining the GP organization, we Will be able to improve their knowledge and technology to help more customers to provide more advanced, safer, more interoperable solutions." GP organization executive director Kevin Gillick also said, "2015 witnessed the credible execution environment Standard (TEE) is another long-term progress in Asia. In order to continuously strengthen and accelerate the development of TEE's ecology in China, GP will be committed to building a strong testing and certification framework. Our TEE compliance program The TEE Compliance Program has been growing continuously, and the top priority in 2016 is to promote the TEE Certification Program. We sincerely hope to further promote the mobile security services in Asia with the expertise and regional influence of Spreadtrum. Deploy and launch."? About GlobalPlatformGlobalPlatform With the platform's standardized infrastructure, service providers can develop services in different markets, devices and channels with a single service. GlobalPlatform's security and privacy parameters provide the foundation for market convergence and innovative cross-industry collaboration by dynamically concentrating multiple providers' secure and unsecured services on the same device. GlobalPlatform is an international industry standard for trusted end-to-end security deployment and management solutions. The widespread use of this technology in the global financial, mobile/telecom, government, medical, retail and transportation industries has reduced costs and time to market. Through its open compliance program for secure chip technology, GlobalPlatform supports long-term interoperability and scalability for application deployment and management. As a non-profit, member-driven association, GlobalPlatform has representatives from different markets across five continents. The Technical Committee and the Marketization Task Force consist of more than 130 members. To learn more about GlobalPlatform members, please visit

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Planar Die Construction Sealed Glass Case Ideally Suited for Automated Insertion - 75V Nominal Zener Voltages

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= 25°C unless otherwise specified Symbol Pd VF RqJA Tj, TSTG Value to +175 Unit mW V K/W °C
Characteristic Forward Voltage = 200mA Thermal Resistance, Junction to Ambient Air (Note 2) Operating and Storage Temperature Range Notes:
1. Tested with Pulses, 20ms. 2. Valid provided that Electrodes are kept at Ambient Temperature.
1. Tested with pulses = 20 ms. 2. Valid provided that electrodes are kept at ambient temperature.
VZ, ZENER VOLTAGE (V) Fig. 1, Zener Current vs Zener Voltage
25 20 VZ, ZENER VOLTAGE (V) Fig. 8, Zener Current vs Zener Voltage
TA, AMBIENT TEMPERATURE (°C) Fig. 3, Power Dissipation vs Ambient Temperature
15 20 VZ, ZENER VOLTAGE (V) Fig. 4, Differential Zener Impedance
VZ, ZENER VOLTAGE (V) Fig. 5, Junction Capacitance vs Zener Voltage

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