In the LED lighting industry, heat conduction and heat dissipation are an important part of current lighting design. It can also be said that if the heat conduction and heat dissipation problems are not solved in the design process, this product is very likely to be a waste product! Moreover, the problem of heat conduction has not been solved, and the radiator is no longer useful. Therefore, I will provide an idea for the heat conduction of aluminum substrates for your reference. Aluminum substrates, as a particularly important thermal material, have special requirements in the wiring process. The following is the most commonly used high-power LED in the industry to discuss the use of copper foil for heat conduction.
In the industry, the most common wiring is as follows:
The heat generated by the LED is transmitted to the aluminum substrate only by the same copper foil surface as the LED heat sink. The cross-sectional view is as follows:
If so, the thermal conduction path can be interpreted as follows: LED heatsink ----- thermal grease ------ copper foil with the same heat sink ------ aluminum substrate insulation layer ----- - Aluminum plate ------ radiator. It can be seen from the figure that the heat conduction path from the LED to the aluminum substrate is only the same as the heat sink size of the LED. If we change our thinking, we will design the aluminum substrate as follows:
We all know that the thermal conductivity of copper is much larger than the thermal conductivity of aluminum. We designed it so that the pad of the LED heat sink is increased as much as possible with the copper foil layer, and the heat conducted by the LED heat sink is fast at the copper layer. Conduction open, and then conducted to the lower aluminum board, artificially increase the heat conduction path, will greatly reduce the temperature of the LED heat sink, as long as possible to extend the working life of the LED.
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