The source pointed out that ZTE has not signed a relevant guilty plea agreement with the US Department of Justice and the Ministry of Finance, and does not rule out the change of personnel due to the personnel changes of the US government.
ZTE, the US Department of Justice and the Ministry of Finance spokesperson declined to comment. A spokesman for the Ministry of Commerce did not respond.
According to sources, ZTE has pleaded guilty to international emergency economic power legislation and other laws. This move may affect ZTE's business development in the United States.
ZTE currently supplies smartphones to AT&T, T-Mobile US and Sprint, as well as components to Qualcomm, Microsoft and Intel. In March last year, ZTE was included as a list of foreign companies that affected US national security, restricting its supply of goods to US companies. ZTE’s announcement on the Shenzhen Stock Exchange on February 14 pointed out that the US Department of Commerce, the Ministry of Justice and the Ministry of Finance discussed the possibility of ending the investigation.
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microwave PCB
microwave PCB`s is a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB`s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
The advantages of using materials with a low X, Y and Z CTE is a resulting PCB structure that will remain extremely stable in high temperature environments while operating at up to 40 GHz in analog applications. This allows for the effective placement of very fine pitch components including, in some cases, bare die-attach. Additionally, the low CTE materials will facilitate the alignment of multiple layers and the features they represent in a complex PCB Layout.
Features
.CTEr = +40/+50 ppm per °C (low); Tg (glass transition temperature) is 280°C
.ER = 3.38/3.48 at 10.0 GHz
.ER is constant to 40.0 GHz
.ED (electro-deposited) copper only
.Layer-to-layer thickness control = +/- 0.001
.Fabrication costs are typical to slightly increased
Microwave PCB,Microwave Frequency PCB,Bare Copper Microwave PCB,High Frequency PCB
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