Texas Instruments (TI) introduced an audio codec with the industry's highest integration level with an embedded miniDSP core, which can cancel echo and noise in applications with wideband voice sampling rates up to 16 kHz. The TLV320AIC3262 highly integrates 5 amplifiers and 2 miniDSP cores, which can help designers connect 3 devices at the same time, such as applications, Bluetooth and baseband processors. Audio and voice samples can be seamlessly received, mixed and processed in the codec, and the codec is configured with TI audio and voice algorithms and third-party algorithms. It can also be used as other licenses and can be created by designers on mobile devices Multifunctional high-definition audio design brings great advantages
The main features and advantages of TLV320AIC3262:
• The third-generation miniDSP technology can cancel broadband noise and echo at frequencies up to 16 kHz, bringing high-definition voice quality to circuit switching or VoIP phones in applications such as video conferencing;
• SRS WOW HD™ can improve audio playback quality. It is a standard feature of the product and does not increase customer costs. It can also increase the processing speed of the host by offloading the task of the host processor to the codec. Designers can also evaluate other certified pre-integrated SRS solutions, including TruMediaTM, CircleSurround HeadphoneTM and TruSurround HDTM. The above solutions can be purchased through the direct license agreement of SRS Labs;
• Three asynchronous audio buses and asynchronous sample rate conversion (ASRC) allow designers to connect multiple audio resources and configure multiple sample rates;
• The intelligent speaker protection algorithm can control the voice coil temperature and the deviation of the diaphragm to maximize the volume without damaging the speaker.
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Availability
The TLV320AIC3262 in a 4.8 mm x 4.8 mm WCSP package is now available.
Tools and support
TLV320AIC3262EVM-U can help designers evaluate the performance of TLV320AIC3262. IBIS model and miniDSP software driver can also be provided at the same time.
PurePathTM Studio Graphic Development Environment (GDE) can simplify the product design process through miniDSP and audio processing functions. GDE includes all algorithms of the previous software version, as well as new algorithms and enhanced features specifically for TLV320AIC3262. Compared with the previous generation products, the enhanced version of the software can also run more algorithms in parallel.
Ensure constant high-quality audio
TLV320AIC3262 can be easily paired with TI boosted class D speaker amplifiers such as TPA2015, TPA2025 and TPA2080. These devices can maintain a constant power output when the battery power drops, further enhancing the various algorithms of the TLV320AIC3262 and protecting the speakers.
Designers who use different digital signal processing solutions can use TLV320AIC3212 to design, and give full play to the high integration and various feature advantages of TLV320AIC3262 without increasing the cost of miniDSP. The two codecs are pin-to-pin compatible, and users of TLV320AIC3212 can easily upgrade to the miniDSP technology of TLV320AIC3262.
Improve mobile device user experience
Audio is only part of the user experience. TI not only provides a wide range of touch screen controllers and tactile drivers to enhance the mobile device experience, but also provides various series of battery management, wireless power and portable power solutions to extend battery life.
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