This year's World Mobile Communications Conference (MWC, 2/27~3/2) may have a bit of "schizophrenia" - vendors will show at the booth how cool 5G communication technology will be available in a few years. To attract visitors, but what they really sell is the 4G products that can be used now.
Two competing vendors, Intel and Qualcomm, are good examples. They are all planning to showcase the 5G technology results in the lab stage. At the same time, they should make LTE products debut and actively expand the 4G market. Qualcomm will Launched the first product of a joint venture with Japanese manufacturer TDK, Intel is to publish a Gb-grade cellular network infrastructure LTE modem and chip.
Will Strauss, principal analyst at market research firm Forward Concepts, said that this year's MWC will: "It's all about 5G technology, or what people think is 5G."
The user scenarios presented at the conference are expected to focus on the first wave of 5G products - including mobile broadband, especially millimeter-wave frequencies and low-latency, high-reliability services; as Rob Topol, head of Intel's 5G business group, said In fact, 5G is expected to make virtual reality (VR) headsets really get rid of cockroaches, and to create multimedia-equipped drones.
Intel will showcase the third-generation 5G client device development platform based on the StraTIx 10 FPGA with a 10 Gbp data transfer rate and 900 MHz channel; the platform supports 600MHz to 39GHz frequency, and the wide range can support the planning of countries around the world. Different 5G communication bands.
At the International Consumer Electronics Show (CES 2017) at the beginning of the year, Intel revealed that it will launch samples of 5G smart phone modem chips by the end of this year, which is equivalent to the time schedule that 3GPP expects to introduce the draft 5G new radio air interface standard; The standard-set engineers said that the first phase of the 5G standard is not expected to be formally approved until May 2018.
In addition, Intel will adopt an earlier version of the development platform to establish a 5G-like link between a car and Ericsson's base station, using an 800MHz channel to achieve a speed of 5~7 Gbps; Topol revealed: "We will Demonstrate interoperability between chip vendors and infrastructure vendors in the air—an important step in establishing 5G as an air interface.†Qualcomm demonstrated a similar 5G link prototype at Shanghai MWC last June.
Intel's Topol said that the company's show at MWC 2017 aims to give visitors a look at the purely theoretical 5G usage scenarios of the past: "How to be a true consumer experience."
He also said that don't expect to see too much about 5G's application in the Internet of Things at MWC, because the IoT function of the 5G standard is expected to be mentioned in the Release 16 version, which is more than the first wave of Release 15 (laying the honeycomb) Communication is based on a larger data transfer rate and a lower latency basis.
Therefore, in terms of the Internet of Things, MWC is expected to focus on the LTE-derived versions of Cat-M and Narrowband IoT, which have been field trial and trial operation by telecom operators; Topol said: "We need more Cat-M Deployment, to observe the use of the 5G Internet of Things, and how the relevant standard specifications need to be adjusted."
The next-generation Intel QuickAssist Adapter family enables IoT and network edge devices to handle larger amounts of data, speeding up to 100 Gbps in processing operations such as encryption, compression, and public key
As for Qualcomm, the company also plans to use 5G as the focus of this year's MWC booth. ..
Qualcomm's X50 5G modem, released last year, will be sampling this year with eight 100MHz channels, 2x2 MIMO antenna arrays, adaptive beamforming (adapTIve beamforming) technology and 64 QAM to achieve a 90dB link budget and The other 28 GHz transceiver works in conjunction with the power management chip.
4G will be the focus of Qualcomm's new products at MWC this year. The company has just released a series of RF front-end modules that extend its reach beyond the dominant smart phone market; new products include Qualcomm's first arsenic Power amplifiers made of gallium (GaAs), as well as other front-end modules and discrete components of filters, can begin to provide samples.
These new products are produced by RF360 Holdings Singapore, a joint venture between Qualcomm and Japan's TDK a year ago; four multimode, multi-frequency power amplifiers support low, medium and high frequency bands, of which QPA5461 supports high-power terminal equipment with high output power 31 dBm is expected to double the coverage on LTE networks.
The new product also includes three antenna tuning chip QAT35xx series, which is built with Snapdragon 835 processor; this series of chips can support customers to use metal casing and 600MHz frequency band to make antenna conversion faster. These components supporting carrier aggregation (carrier aggregaTIon) have been mass-produced, and it is expected that the terminal application device will soon be available.
Qualcomm demonstrates RF front-end chip applications in new high-end smartphones
According to Will Strauss, principal analyst at Forward Concepts, with the new product: "Qualcomm is basically stealing large RF component suppliers such as Skyworks SoluTIons, Qorvo, and Peregrine and Cavinishish Kinetics, which specialize in RF switches, and even antenna specialist Skycross. The site of Ethertronics."
Market research firm Mobile Experts estimates that the RF front-end chip market is expected to reach $18 billion by 2020, with a compound annual growth rate of 13%; Qualcomm expects high-end handsets to support 40 bands by 2020. The 100 filters are double the 50 filters that support 15 bands in 2015.
Intel's 4G product detailsIntel will showcase Gbit-class LTE modems at MWC, which is currently the leader of Qualcomm; although Intel's latest chips support Gbps-level downlinks, speeds vary depending on the operator's deployment. . Strauss pointed out that Qualcomm's cooperation with an Australian telecommunications operator showed that its LTE transmission rate reached 935 Mbps.
The XMM7560 chip is manufactured on a 14-nm process and is Intel's first modem chip manufactured by its own fab, rather than commissioned by TSMC. Intel expects the same 5G component samples to be released later this year. Process.
Strauss believes that Intel will upgrade at least a portion of the 7nm process ready for mass production at the Fab 42 fab to a low-power CMOS process; this plan is expected to allow Intel to further expand its foundry business. The company is still working hard to achieve the goal so far.
Rob Topol, head of Intel's 5G business group, said the XMM7560 is the company's first six-band smart phone modem chip, including all global positioning systems; the Release 13-compliant chip can handle up to five bands with a single transceiver. Carrier aggregation and support for more than 35 bands from 700MHz to 6GHz.
Apple may be the driver of Intel's new high-profile chip, which occupies a position on the iPhone 7, because the previously used baseband chip suppliers Qualcomm and Apple are on the verge of a patent issue.
In addition, Intel has also released a series of server-related products that will be applied to the Cloud Wireless Access Network (C-RAN); C-RAN will focus on the back-end hive processing tasks on the server farm; the new Xeon D-1500 can handle 9 per second. L3 forwarding of 000 million packets and encryption or compression at 100 Gbps.
Lynn Comp, senior director of Intel's network business group, said that some telecom operators headed by China Mobile in Asia are conducting field trials of C-RAN deployment, but most European and American telecom operators lack support for such distribution. The fiber optic network of the system.
Compilation: Judith Cheng
(Reference: Intel, Q'comm Show Cellular's Split, by Rick Merritt)
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