One of the most important challenges in design is how to effectively remove more heat from a larger unit of power when the architecture is tight and the operating space is getting smaller. Every 10 °C lower for sensitive components, the power supply heat dissipation material - thermal silica film
As a medium for transferring heat, the thermal conductive silica gel has excellent electrical insulation and excellent thermal conductivity, and has high and low temperature resistance. It can work in the temperature range of -60 ° C to 200 ° C for a long time without air drying and hardening. Or melting phenomenon. This product is based on polysiloxane, supplemented by high thermal conductivity filler, non-toxic, tasteless, non-corrosive, chemical and physical properties stable.
The main purpose:
Surface coating and integral potting for microwave devices such as switching power supplies, thermostats, heat sinks, microwave communication, microwave transmission equipment, special power supplies, and regulated power supplies for heat and temperature resistance It can also be used as a heat transfer insulating filling material for transistors and semiconductor transistors to improve its pass rate. SP150 thermal conductivity 1.75w/mk SP160 thermal conductivity 2.45w/mk
The flexible silicone thermal insulation insulating pad is one of the heat transfer interface materials, has good thermal conductivity and high level of withstand voltage, and its function is to fill the large requirement between the processor and the heat sink, and is an alternative thermal grease thermal grease. The best product for the binary cooling system of mica sheets.
As electronic devices continue to integrate more powerful functions into smaller components, temperature control has become important for installation and service life. The thermal conductivity of the product is 2.45W/mK, the voltage breakdown resistance is above 4000 volts, and it has a certain flexibility. It is a good fit between the power device and the heat-dissipating aluminum sheet or machine casing to achieve the best thermal conductivity. And the purpose of heat dissipation, in line with the current requirements of the electronic industry for thermal materials.
The process thickness of silicone thermal insulation insulating mat varies from 0.5mm to 5mm, 0.5g per mm, ie 0.5mm 1mm 1.5mm 2mm up to 5mm, special requirements can be increased to 10mm, specially designed for the transmission of heat through the gap. It can fill the gap, complete the heat transfer between the heat-generating part and the heat-dissipating part, and also play the role of damping insulation and sealing, etc. It can meet the design requirements of miniaturization and ultra-thinness of the equipment, and is a new material with great craftability and usability. And the thickness is applicable to a wide range of applications, especially for the electronic equipment industry such as automobiles, displays, computers and power supplies.
Flame retardant fire resistance meets UL 94V-0 requirements and complies with EU SGS environmental certification
Working temperature is generally between -50 ° C ~ 220 ° C
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