Quantification of Thermal Parameters in High Power LED Packages

On October 15, Dr. Rafael Jordan of the Fraunhofer Institute for Reliability and Microintegration at the 7th China International Semiconductor Lighting Forum Thermal Management and Reliability Technology Division made a "quantification of thermal parameters for high-power LED packages." Report.

The report states that thermal management is a key factor in the efficiency, reliability, and long-term stability of LED systems. Although people do a lot of simulations and calculations, it is a difficult problem to measure true temperature without affecting the system.

At the meeting, Rafael Jordan also introduced some researches made by the Fraunhofer Institute for Reliability and Microintegration of Germany, such as the use of time analysis of high-resolution thermal imaging methods to analyze the thermal parameters in high-power LED packages. The self-heating effect of the converter is applied to the thermal imaging system for research.