Recently, Jingke Electronics' two invention patents, "A Light-emitting Device with Integrated Circuits and Its Manufacturing Method" and "A Light-Emitting Diode Device and Its Manufacturing Method" have been successfully authorized by the State Intellectual Property Office.
<<A light-emitting device having an integrated circuit and a method of manufacturing the same>>, Patent No. 1, the invention relates to a light-emitting device having an integrated circuit, comprising an LED chip and a substrate. The LED chip has a P electrode and an N electrode. An integrated circuit, a first metal electrode, a second metal electrode layer, and an electrode layer connection portion are disposed on the substrate.
The integrated circuit is disposed on a lower surface of the substrate, the first metal electrode layer covers an upper surface of the substrate, and the second metal electrode layer covers a lower surface of the substrate and is connected to an integrated circuit, the electrode layer The connection portion connects the first electrode layer and the second electrode layer through the upper surface and the lower surface of the substrate. The LED chip is flip-chip mounted on the substrate, and the P electrode and the N electrode of the LED chip are respectively connected to the first metal electrode layer on the substrate. The light-emitting device with integrated circuit of the present invention can avoid photoelectric parasitic effects and has high stability.
"A light-emitting diode device and a method of manufacturing the same", Patent No. 5. A light emitting diode device includes at least one LED chip and a circuit board. The LED chip has an N pole and a P pole, and an electrode layer is covered on the surfaces of the N pole and the P pole, wherein the electrode layers on the surface of the N pole and the P pole have the same thickness.
The upper surface of the circuit board is covered with an insulating layer, the upper surface of the insulating layer is covered with a conductive layer, and a metal layer is disposed on the upper surface of the region of the conductive layer corresponding to the N pole of the LED chip, and the thickness of the metal layer is LED The height difference between the N pole and the P pole of the chip. The LED chip is flip-chip mounted on the upper surface of the circuit board, wherein the P pole of the LED chip is connected to the conductive layer through the electrode layer, and the N pole of the LED chip is connected to the conductive layer through the electrode layer and the metal layer. Compared with the prior art, a metal layer is disposed on a circuit board of the light-emitting device of the present invention corresponding to the N-pole region of the LED chip, which simplifies the design and manufacturing process of the LED chip, and further improves the performance of the LED chip.
The two inventions are of great significance for optimizing the chip and package manufacturing process. The application results are easy to use. The gold-free package products based on flip-chip soldering technology have been widely used in the market in the past two years, including the high speed of Yixing (3535) products. The highway LED tunnel lighting project won 100 awards for global lighting engineering exhibition. Up to now, Jingke Electronics has applied for 77 patents.
<<A light-emitting device having an integrated circuit and a method of manufacturing the same>>, Patent No. 1, the invention relates to a light-emitting device having an integrated circuit, comprising an LED chip and a substrate. The LED chip has a P electrode and an N electrode. An integrated circuit, a first metal electrode, a second metal electrode layer, and an electrode layer connection portion are disposed on the substrate.
The integrated circuit is disposed on a lower surface of the substrate, the first metal electrode layer covers an upper surface of the substrate, and the second metal electrode layer covers a lower surface of the substrate and is connected to an integrated circuit, the electrode layer The connection portion connects the first electrode layer and the second electrode layer through the upper surface and the lower surface of the substrate. The LED chip is flip-chip mounted on the substrate, and the P electrode and the N electrode of the LED chip are respectively connected to the first metal electrode layer on the substrate. The light-emitting device with integrated circuit of the present invention can avoid photoelectric parasitic effects and has high stability.
"A light-emitting diode device and a method of manufacturing the same", Patent No. 5. A light emitting diode device includes at least one LED chip and a circuit board. The LED chip has an N pole and a P pole, and an electrode layer is covered on the surfaces of the N pole and the P pole, wherein the electrode layers on the surface of the N pole and the P pole have the same thickness.
The upper surface of the circuit board is covered with an insulating layer, the upper surface of the insulating layer is covered with a conductive layer, and a metal layer is disposed on the upper surface of the region of the conductive layer corresponding to the N pole of the LED chip, and the thickness of the metal layer is LED The height difference between the N pole and the P pole of the chip. The LED chip is flip-chip mounted on the upper surface of the circuit board, wherein the P pole of the LED chip is connected to the conductive layer through the electrode layer, and the N pole of the LED chip is connected to the conductive layer through the electrode layer and the metal layer. Compared with the prior art, a metal layer is disposed on a circuit board of the light-emitting device of the present invention corresponding to the N-pole region of the LED chip, which simplifies the design and manufacturing process of the LED chip, and further improves the performance of the LED chip.
The two inventions are of great significance for optimizing the chip and package manufacturing process. The application results are easy to use. The gold-free package products based on flip-chip soldering technology have been widely used in the market in the past two years, including the high speed of Yixing (3535) products. The highway LED tunnel lighting project won 100 awards for global lighting engineering exhibition. Up to now, Jingke Electronics has applied for 77 patents.
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