This time, Gaogong LED Exhibition Lianlang New Materials exhibited six silicon-modified epoxy adhesives to provide customers with industry-leading solutions for LED packaging. Li Benjie's focus this time is on the fast curing encapsulant. This glue can be UV cured in ten seconds, which is a better choice for the white light patch of the packaging factory.
"We have completely solved the problems of high temperature resistance, embrittlement cracking, etc., and can achieve zero light decay of medium and high power devices," Li Benjie said. During the exhibition, many packaging companies took information or talked with Li Benjie about the performance of epoxy resin. The response was very enthusiastic.
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Henan Shuyi Electronics Co., Ltd. , https://www.shuyioemminipc.com