Shenzhen Chenri Technology Co., Ltd. (hereinafter referred to as “Chenri Technologyâ€), which is dedicated to the research, development, production and sales of electronic soldering materials and semiconductor packaging materials, has a group of Ph.D. and master's research and development teams with many years of research and development experience. Technological development of materials.
This time at the 2012 High-tech LED Exhibition, the products that Morning Technology will show to the industry mainly include die-cast solder paste for LED packaging and assembly, silicone, assembled SMT solder paste and fluorescent glue.
"Fluorescent glue combines silica gel and phosphor powder to help customers simplify the powder mixing process. It can be directly formed by dispensing or printing. It can be directly cured into a hemispherical shape or a flat shape to meet the light efficiency requirements without the need of a molding die. Qian Xuexing, general manager of Morning Technology, said that both solid crystal solder paste and fluorescent glue are new products developed by the company to meet the needs of LED package assembly and integration, and to simplify the packaging and assembly process to the utmost.
Qian Xuexing said that the company is using solid crystal solder paste and fluorescent glue to build a new process for LED packaging and assembly on the same substrate, thereby reducing packaging and assembly costs and increasing packaging capacity.
“By benefiting from some newly developed products, the sales performance of the company in the first half of the year is still growing.†Qian Xuexing said that the packaging process is still in a process of continuous innovation with the change of chip structure, especially the flip-chip. The emergence of LED chip technology will bring the greatest process simplification to LED packaging and assembly, thus helping packaging companies to reduce equipment and manpower investment.
Qian Xuexing said that the solid crystal solder paste and fluorescent glue belong to the new material in the field of LED packaging, which can fully meet the requirements of the packaging process. "Morning Technology will focus on the research and development of new materials in the future, and continuously develop welding materials and bonding materials that meet the integration of LED packaging and assembly, providing integrated solutions for packaging and assembly manufacturers."
2012 High-tech LED Exhibition Exhibition Address: Guangzhou Poly World Trade Center Expo Booth No.: 2G02
Exhibition date: August 17-19, 2012
This time at the 2012 High-tech LED Exhibition, the products that Morning Technology will show to the industry mainly include die-cast solder paste for LED packaging and assembly, silicone, assembled SMT solder paste and fluorescent glue.
"Fluorescent glue combines silica gel and phosphor powder to help customers simplify the powder mixing process. It can be directly formed by dispensing or printing. It can be directly cured into a hemispherical shape or a flat shape to meet the light efficiency requirements without the need of a molding die. Qian Xuexing, general manager of Morning Technology, said that both solid crystal solder paste and fluorescent glue are new products developed by the company to meet the needs of LED package assembly and integration, and to simplify the packaging and assembly process to the utmost.
Qian Xuexing said that the company is using solid crystal solder paste and fluorescent glue to build a new process for LED packaging and assembly on the same substrate, thereby reducing packaging and assembly costs and increasing packaging capacity.
“By benefiting from some newly developed products, the sales performance of the company in the first half of the year is still growing.†Qian Xuexing said that the packaging process is still in a process of continuous innovation with the change of chip structure, especially the flip-chip. The emergence of LED chip technology will bring the greatest process simplification to LED packaging and assembly, thus helping packaging companies to reduce equipment and manpower investment.
Qian Xuexing said that the solid crystal solder paste and fluorescent glue belong to the new material in the field of LED packaging, which can fully meet the requirements of the packaging process. "Morning Technology will focus on the research and development of new materials in the future, and continuously develop welding materials and bonding materials that meet the integration of LED packaging and assembly, providing integrated solutions for packaging and assembly manufacturers."
2012 High-tech LED Exhibition Exhibition Address: Guangzhou Poly World Trade Center Expo Booth No.: 2G02
Exhibition date: August 17-19, 2012
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